RabbitCore RCM4500W User's Manual

Appendix A. RCM4510W Specifications

Appendix A provides the specifications for the RCM4510W, and describes the conformal coating.

A.1 Electrical and Mechanical Characteristics

Figure A-1 shows the mechanical dimensions for the RCM4510W.

Figure A-1. RCM4510W Dimensions

NOTE	All measurements are in inches followed by millimeters enclosed in parentheses. All dimensions have a manufacturing tolerance of ±0.01" (0.25 mm).

It is recommended that you allow for an "exclusion zone" of 0.04" (1 mm) around the RCM4510W in all directions when the RCM4510W is incorporated into an assembly that includes other printed circuit boards. An "exclusion zone" of 0.08" (2 mm) is recommended below the RCM4510W when the RCM4510W is plugged into another assembly. Figure A-2 shows this "exclusion zone."

Figure A-2. RCM4510W "Exclusion Zone"

NOTE

There is an antenna associated with the RCM4510W RabbitCore modules. The antenna is on the XBee RF modules for the standard versions of the RCM4510W, and is on the printed circuit board near the shielded modem below header J4. Do not use any RF-absorbing materials in these vicinities in order to realize the maximum range.

Table A-1 lists the electrical, mechanical, and environmental specifications for the RCM4510W.

Table A-1. RCM4510W Specifications 

Parameter		RCM4510W
Microprocessor		Rabbit® 4000 at 29.49 MHz
Flash Memory		512K
Data SRAM		512K
Backup Battery		Connection for user-supplied backup battery (to support RTC and data SRAM)
General Purpose I/O		up to 49 parallel digital I/0 lines: · up to 40 Rabbit 4000 pins configurable with four layers of alternate functions · up to 9 XBee RF module pins, four of which may be configured as analog inputs1
Additional Inputs		Startup mode (2), reset in
Additional Outputs		Status, reset out
Analog Inputs*		4 channels single-ended 0–1.2 V DC
A/D Converter Resolution		10 bits
A/D Conversion Time (including raw count and Dynamic C)		40 ms
External I/O Bus		Can be configured for 8 data lines and 6 address lines (shared with parallel I/O lines), plus I/O read/write
Serial Ports		6 high-speed, CMOS-compatible ports: all 6 configurable as asynchronous (with IrDA), 4 as clocked serial (SPI), and 2 as SDLC/HDLC 1 asynchronous clocked serial port shared with programming port
Serial Rate		Maximum asynchronous baud rate = CLK/8
Slave Interface		Slave port allows the RCM4510W to be used as an intelligent peripheral device slaved to a master processor
Real Time Clock		Yes
Timers		Ten 8-bit timers (6 cascadable from the first), one 10-bit timer with 2 match registers, and one 16-bit timer with 4 outputs and 8 set/reset registers
Watchdog/Supervisor		Yes
Pulse-Width Modulators		4 channels synchronized PWM with 10-bit counter 4 channels variable-phase or synchronized PWM with 16-bit counter
Input Capture		2-channel input capture can be used to time input signals from various port pins
Quadrature Decoder		2-channel quadrature decoder accepts inputs from external incremental encoder modules
Power with ZigBee® Modem (pins unloaded)		3.3 V.DC ±5%
		150 mA @ 3.3 V while transmitting/receiving 80 mA @ 3.3 V while not transmitting/receiving <20 µA @ 3.3 V while asleep
Operating Temperature		-40°C to +85°C
Humidity		5% to 95%, noncondensing
Connectors		One 2 × 7, 2 mm pitch IDC signal header One 2 × 25, 1.27 mm pitch IDC signal header One 2 × 5, 1.27 mm pitch IDC programming header
Board Size with XBee RF module Installed		1.84" × 2.85" × 0.54" (47 mm × 72 mm × 14 mm)
XBee RF Module
RF Module		Digi International XBee®
Compliance		802.15.4 standard (ZigBee compliant)

1 These I/O pins from the XBee RF module are available on auxiliary I/O header J4.

A.1.1 XBee RF Module

Table A-2 shows the XBee RF module specifications.

Table A-2. XBee RF Module Specifications

Parameter		Specification
RF Module		Digi International XBee®
Compliance		802.15.4 standard (ZigBee compliant)
Frequency		ISM 2.4 GHz
Performance	Indoor Range	100 ft (30 m)
	Outdoor Line-of-Sight Range	300 ft (90 m)
	Transmit Power Output	1 mW (0 dBm)
	RF Data Rate	250,000 bps
	Receiver Sensitivity	-92 dBm (1% PER)
Antenna		Chip antenna
Supported Network Topologies		Point-to-point Point-to-multipoint Peer-to-peer Mesh
Number of RF Channels		16 direct-sequence channels
Filtration Options		PAN ID Channel Source/destination addresses
Power (typical)	Transmit	40 mA @ 3.3 V DC ±5%
	Idle/Receive	40 mA @ 3.3 V DC ±5%

The XBee RF module that consists of discrete components on the preview versions of the RCM4510W module has the same specifications.

A.1.2 Headers

The RCM4510W uses a header at J1 for physical connection to other boards. J1 is a 2 ×  25 SMT header with a 1.27 mm pin spacing. J2, the programming port, is a 2 ×  5 header with a 1.27 mm pin spacing. Header J4 supplies auxiliary I/O supported by the XBee RF module, and is a 2 ×  7 SMT header with a 2 mm pin spacing

Figure A-3 shows the layout of another board for the RCM4510W to be plugged into. These reference design values are relative to one of the mounting holes.

Figure A-3. User Board Footprint for RCM4510W

A.2 Rabbit 4000 DC Characteristics

Table A-3. Rabbit 4000 Absolute Maximum Ratings

Symbol	Parameter	Maximum Rating
TA	Operating Temperature	-40° to +85°C
TS	Storage Temperature	-55° to +125°C
VIH	Maximum Input Voltage	VDDIO + 0.3 V (max. 3.6 V)
VDDIO	Maximum Operating Voltage	3.6 V

Stresses beyond those listed in Table A-3 may cause permanent damage. The ratings are stress ratings only, and functional operation of the Rabbit 4000 chip at these or any other conditions beyond those indicated in this section is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect the reliability of the Rabbit 4000 chip.

Table A-4 outlines the DC characteristics for the Rabbit 4000 at 3.3 V over the recommended operating temperature range from T_A = –40°C to +85°C, VDD_IO = 3.0 V to 3.6 V.

Table A-4. 3.3 Volt DC Characteristics

Symbol	Parameter	Min	Typ	Max
VDDIO	I/O Ring Supply Voltage, 3.3 V	3.0 V	3.3 V	3.6 V
	I/O Ring Supply Voltage, 1.8 V	1.65 V	1.8 V	1.90 V
VIH	High-Level Input Voltage (VDDIO = 3.3 V)		2.0 V
VIL	Low-Level Input Voltage (VDDIO = 3.3 V)		0.8 V
VOH	High-Level Output Voltage (VDDIO = 3.3 V)		2.4 V
VOL	Low-Level Output Voltage (VDDIO = 3.3 V)		0.4 V
IIO	I/O Ring Current @ 29.4912 MHz, 3.3 V, 25°C			12.2 mA
IDRIVE	All other I/O (except TXD+, TXDD+, TXD-, TXDD-)			8 mA

A.3 I/O Buffer Sourcing and Sinking Limit

Unless otherwise specified, the Rabbit I/O buffers are capable of sourcing and sinking 8 mA of current per pin at full AC switching speed. Full AC switching assumes a 29.4 MHz CPU clock with the clock doubler enabled and capacitive loading on address and data lines of less than 70 pF per pin. The absolute maximum operating voltage on all I/O is 3.6 V.

A.4 Bus Loading

You must pay careful attention to bus loading when designing an interface to the RCM4510W. This section provides bus loading information for external devices.

Table A-5 lists the capacitance for the various RCM4510W I/O ports.

Table A-5. Capacitance of Rabbit 4000 I/O Ports

I/O Ports	Input Capacitance (pF)	Output Capacitance (pF)
Parallel Ports A to E	12	14

Table A-6 lists the external capacitive bus loading for the various RCM4510W output ports. Be sure to add the loads for the devices you are using in your custom system and verify that they do not exceed the values in Table A-6.

Table A-6. External Capacitive Bus Loading -40°C to +85°C

Output Port	Clock Speed (MHz)	Maximum External Capacitive Loading (pF)
All I/O lines with clock doubler enabled	29.49	100

Figure A-4 shows a typical timing diagram for the Rabbit 4000 microprocessor external I/O read and write cycles.

Figure A-4. External I/O Read and Write Cycles—No Extra Wait States

NOTE	/IOCSx can be programmed to be active low (default) or active high.

Table A-7 lists the delays in gross memory access time for several values of VDD_IO.

Table A-7. Preliminary Data and Clock Delays

VDDIO (V)	Clock to Address Output Delay (ns)			Data Setup Time Delay (ns)	Worst-Case Spectrum Spreader Delay (ns)
	30 pF	60 pF	90 pF		0.5 ns setting no dbl / dbl	1 ns setting no dbl / dbl	2 ns setting no dbl / dbl
3.3	6	8	11	1	2.3 / 2.3	3 / 4.5	4.5 / 9
1.8	18	24	33	3	7 / 6.5	8 / 12	11 / 22

The measurements are taken at the 50% points under the following conditions.

• T = -40°C to 85°C, V = VDD_IO ±10%

• Internal clock to nonloaded CLK pin delay ≤ 1 ns @ 85°C/3.0 V

The clock to address output delays are similar, and apply to the following delays.

• T_adr, the clock to address delay

• T_CSx, the clock to memory chip select delay

• T_IOCSx, the clock to I/O chip select delay

• T_IORD, the clock to I/O read strobe delay

• T_IOWR, the clock to I/O write strobe delay

• T_BUFEN, the clock to I/O buffer enable delay

The data setup time delays are similar for both T_setup and T_hold.

When the spectrum spreader is enabled with the clock doubler, every other clock cycle is shortened (sometimes lengthened) by a maximum amount given in the table above. The shortening takes place by shortening the high part of the clock. If the doubler is not enabled, then every clock is shortened during the low part of the clock period. The maximum shortening for a pair of clocks combined is shown in the table.

Technical Note TN227, Interfacing External I/O with Rabbit Microprocessor Designs, contains suggestions for interfacing I/O devices to the Rabbit 4000 microprocessors.

A.5 Conformal Coating

The areas around the 32 kHz real-time clock crystal oscillator have had the Dow Corning silicone-based 1-2620 conformal coating applied. The conformally coated area is shown in Figure A-5. The conformal coating protects these high-impedance circuits from the effects of moisture and contaminants over time.

Figure A-5. RCM4510W Areas Receiving Conformal Coating

Any components in the conformally coated area may be replaced using standard soldering procedures for surface-mounted components. A new conformal coating should then be applied to offer continuing protection against the effects of moisture and contaminants.

NOTE	For more information on conformal coatings, refer to Rabbit's Technical Note TN303, Conformal Coatings, which is included with the online documentation.

A.6 Jumper Configurations

Figure A-6 shows the header locations used to configure the various RCM4510W options via jumpers.

Figure A-6. Location of RCM4510W Configurable Positions

Table A-8 lists the configuration options.

Table A-8. RCM4510W Jumper Configurations 

Header	Description	Pins Connected		Factory Default
JP1	PE5 or SMODE0 Output on J1 pin 37	1–2	PE5	×
		2–3	SMODE0
JP2	PE6 or SMODE1 Output on J1 pin 38	1–2	PE6	×
		2–3	SMODE1
JP3	PE7 or STATUS Output on J1 pin 39	1–2	PE7	×
		2–3	STATUS
JP4	LN0 or PD0 on J1 pin 40	1–2	LN0
		2–3	PD0	×
JP5	LN2 or PD2 on J1 pin 42	1–2	LN2
		2–3	PD2	×
JP6	LN4 or PD4 on J1 pin 44	1–2	LN4
		2–3	PD4	×
JP7	LN6 or PD6 on J1 pin 46	1–2	LN6
		2–3	PD6	×
JP8	LN7 or PD7 on J1 pin 47	1–2	LN7
		2–3	PD7	×
JP9	LN5 or PD5 on J1 pin 45	1–2	LN5
		2–3	PD5	×
JP10	LN3 or PD3 on J1 pin 43	1–2	LN3
		2–3	PD3	×
JP11	LN1 or PD1 on J2 pin 41	1–2	LN1
		2–3	PD1	×

NOTE	The jumper connections are made using 0 W surface-mounted resistors.